The JY360 Diamond Wire Multi-Wire Cutting Machine is specialized for high-precision cutting of hard and brittle materials such as silicon crystals, sapphire, ceramics, and other semiconductor materials. Utilizing advanced diamond-coated wire technology, it achieves ultra-thin, high-efficiency, and low-loss cutting, making it an essential equipment in photovoltaic, semiconductor, and optoelectronic industries.
Main Features:
High-Precision Cutting: Capable of cutting with micron-level accuracy, ensuring smooth and damage-free surfaces.
Multi-Wire Synchronization: Multiple diamond wires operate simultaneously, significantly improving production efficiency.
Advanced Control System: Equipped with an intelligent control unit for real-time monitoring and adjustment of cutting parameters.
Low Material Loss: Optimized wire tension and feed mechanisms minimize material waste.
Stable Performance: Robust mechanical structure ensures long-term operational stability under high-load conditions.
Applications:
Silicon ingot cutting for solar cells
Sapphire wafer processing for LEDs
Precision ceramic component manufacturing
Other hard and brittle material cutting
For technical specifications or customized solutions, please contact our sales team.
